Spanning 100,000 square meters, the exhibition will host an international lineup of industrial leaders, including Panasonic, ASMPT, Fuji, Yamaha, and Omron, alongside prominent Chinese brands like AXXON and GKG. The event focuses on the rapid integration of AI into hardware production, with over 200 new product debuts covering fields from semiconductor packaging to automotive electronics.
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NEPCON ASIA 2026 to Showcase AI-Driven Manufacturing in Shenzhen
With Asia now accounting for over 58% of global electronics production, the industry is converging on Shenzhen for NEPCON ASIA 2026. Scheduled for October 27–29 at the Shenzhen World Exhibition & Convention Center, the event serves as a primary hub for sourcing next-generation manufacturing equipment and advanced production solutions.
Technical programming centers on three specialized demonstration zones. The Optical Module Manufacturing Process Demo Zone will provide live workflows for 800G, 1.6T, and 3.2T modules, while the 2026 Computing Power Expo addresses the infrastructure required for data centers and AI chips. Additionally, an automotive electronics line will demonstrate high-voltage wire harnessing and reliability testing, aimed at helping suppliers optimize yields for mass production. More than 40 professional forums will run concurrently, addressing technical shifts in 6G, embodied intelligence, and green factory operations. The show is part of the broader Industrial Technology World Asia portfolio, which draws a combined 170,000 professional attendees across multiple co-located industrial events.
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