EverProX Unveils MSDL 20G Chipset for High-Speed MIPI Connectivity

The MSDL 20G chipset, featuring the SL8582x serializer and SL8581x de-serializer, integrates VCSEL drivers to support both optical and differential copper connections. This architecture allows engineers to transmit high-speed data while keeping power consumption below 100 mW per link—specifically 71 mW for optical and 87 mW for electrical configurations. The design also incorporates a bidirectional sideband SerDes to manage I2C, SPI, and GPIO control signals, significantly reducing the complexity of cable and connector requirements.

Yifeng Liann, CEO of EverProX, noted that the industry is facing a critical need to move massive amounts of data in real time as AI becomes more physically distributed. The new chipset targets space-constrained and mission-critical fields, including medical endoscopy, AR/VR head-mounted displays, industrial robotics, and defense UAVs. By minimizing heat generation and cable weight, the solution aims to simplify the integration of high-frame-rate sensors into intelligent hardware.

Sampling is currently available for early-access customers in both bare die and 4x4 mm µBGA-78 packaging. The company is also providing evaluation kits to assist in link validation and system prototyping, offering a path from initial design to mass production for manufacturers looking to replace traditional shielded cabling.