As artificial intelligence and high-performance computing demand increasingly dense packaging, the industry is pivoting toward glass substrates. Spirox addressed this shift at its 2026 Advanced Packaging Technology Forum in Hsinchu, unveiling the SP7000G inspection system designed to detect microscopic structural flaws in high-volume glass core manufacturing.
The SP7000G system utilizes laser tomography to identify internal microcracks in glass substrates after metallization and ABF build-up. The machine performs a full-panel scan of a 510 mm by 515 mm substrate in under 20 minutes, a speed aimed at streamlining quality control for next-generation AI server components.
Industry partners, including Corning and DNP, emphasized that non-destructive inspection is critical as Glass Core technology moves from R&D into mass production. Corning’s Odessa Petzold noted that the laser scanning approach allows for defect detection without compromising the integrity of delicate glass structures. DNP’s Satoru Kuramochi added that such reliability analysis is essential for maintaining yields in large-scale server packaging.
Spirox executive Paul Yang stated that the SP7000G complements the company’s existing SP8000G model. Together, these tools form a specialized suite for TGV (Through-Glass Via) inspection, covering the entire lifecycle from initial development to high-volume output. This expansion reflects a broader effort to build a robust ecosystem for advanced packaging, where monitoring defect distribution is key to optimizing manufacturing efficiency.
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