The transition to megawatt-scale power requirements has rendered traditional cooling and power delivery methods obsolete. To counter these bottlenecks, Compal is implementing 800VDC power architectures alongside advanced liquid-cooling modules. These systems are engineered to function as a singular unit, rather than independent components, ensuring that high-performance GPUs receive consistent energy and thermal regulation at the rack level.
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Compal Debuts Megawatt-Scale AI Infrastructure at OCP Global Summit
As AI data centers shift toward unprecedented compute density, the physical infrastructure governing power and thermal management is undergoing a radical redesign. Compal Electronics is using the OCP Global Summit 2026 in San Jose to unveil its latest integrated systems, designed specifically to support the next generation of NVIDIA accelerated computing.
Alan Chang, Vice President of ISBG at Compal, noted that the company is bridging the gap between advanced silicon and real-world deployment by unifying power, cooling, and rack-scale integration. By moving toward higher-voltage DC configurations, the firm aims to simplify power conversion complexities that currently hinder dense AI environments. These technologies are currently on display at Booth #E65, where the manufacturer is demonstrating how its infrastructure scales from individual server platforms to full-scale data center deployments.
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