AEWIN, a subsidiary of the Qisda Group, is launching its latest hardware portfolio featuring AMD EPYC 9006 series processors and PCIe Gen6 connectivity. The new lineup addresses the cooling constraints of modern AI factories by incorporating specialized 2P DLC technology capable of managing high-TDP components. The BG18-A10710 model achieves extreme density by housing 600W CPUs alongside dual 600W GPUs within a 1U chassis. For more demanding training environments, the 4U flagship BG48-A20813 provides capacity for eight dual-width GPUs.
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AEWIN Debuts DC-MHS AI Servers With Two-Phase Liquid Cooling
Rising thermal demands in AI infrastructure are meeting a new standard at OCP 2026, where AEWIN Technologies is unveiling high-density servers integrated with Arivor’s two-phase direct liquid cooling. The systems, built on the DC-MHS framework, aim to support rack-scale architectures exceeding 200kW while significantly lowering power usage effectiveness.
Beyond raw compute, the architecture prioritizes storage flexibility and system reliability. Models such as the BS28-A10710 and BX28-A10710 offer specialized configurations for NVMe and SATA drives to streamline data-heavy AI pipelines. Every unit utilizes OCP DC-SCM2 management, powered by the ASPEED AST2700 BMC, and Titanium-rated power supplies to ensure stability for cloud-native and HPC deployments. Attendees can view these systems at the OCP Global Summit in San Jose from October 12–15.
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