MSI is expanding its 21-inch ORv3 portfolio with 2-node platforms featuring AMD EPYC 9006 Series processors. These systems, designed for both air and direct liquid cooling, leverage 48V busbar power and PCIe 6.0 connectivity to manage thermal loads up to 600W per node. The CD281-S4091-X2 model focuses on air-cooled, storage-heavy deployments, while the CD182-S6091-X2 uses liquid cooling to maximize compute density within a 1OU footprint. Danny Hsu, General Manager of MSI's Enterprise Platform Solutions, stated that the company’s priority is providing modularity that allows infrastructure to evolve alongside shifting workload requirements.
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MSI Unveils Modular Data Center and AI Hardware at OCP Global Summit
At the 2026 OCP Global Summit in San Jose, MSI is showcasing a new suite of open data center and AI infrastructure. The company’s latest lineup, anchored by 21-inch ORv3 systems and modular DC-MHS building blocks, targets the growing demand for high-density, liquid-cooled computing and flexible AI development.
Beyond ORv3, MSI is scaling its AI capabilities through NVIDIA MGX-based platforms and the XpertStation WS300 desktop supercomputer. The rack-scale configurations incorporate liquid-cooled CG681-S6093 units, which support up to eight NVIDIA RTX PRO 6000 Blackwell GPUs. For local research and development, the XpertStation WS300 offers a desktop-sized solution powered by the NVIDIA GB300 Grace Blackwell Ultra Superchip, allowing developers to prototype and fine-tune large-scale models in either Linux or Windows environments.
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